[Journal of the Semiconductor & Display Technology]

Design of 60-GHz Back-to-back Differential Patch Antenna on Silicon Substrate

[electronics]

Guidelines for Area Ratio between Metal Lines and Vias to Improve the Reliability of Interconnect Systems in High-Density Electronic Devices

[Microelectronic Engineering]

Nano-capsuled thermal interface materials filler using defective multilayered graphene-coated silver nanoparticles

[IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY,]

Thermomechanical Challenges of 2.5-D Packaging: A Review of Warpage and Interconnect Reliability

[IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY]

Effect of the Annealing Process on Cu Bonding Quality Using Ag Nanolayer

[Journal of Electrical Engineering & Technology]

Compact, Flexible and Transparent Antenna Using MMF for Conformal Wi?Fi 7 Applications

[Electronic Materials Letters]

Copper Bonding Technology in Heterogeneous Integration

[APPLIED SCIENCES-BASEL]

A Review of Cell Operation Algorithm for 3D NAND Flash Memory

[JOURNAL OF ELECTRONIC MATERIALS]

Low-Temperature Diffusion Behavior of Ti in Cu/Ti-Ti/Cu Bonding

[APPLIED SURFACE SCIENCE]

Fabrication of multilayer Graphene-coated Copper nanoparticles for application as a thermal interface material

[APPLIED SCIENCES-BASEL]

The Effect of an Ag Nanofilm on Low-Temperature Cu/Ag-Ag/Cu Chip Bonding in Air

[마이크로전자 및 패키징학회지]

저온 Cu-Cu본딩을 위한 12nm 티타늄 박막 특성 분석

[마이크로전자 및 패키징학회지]

저온 Cu/Ag-Ag/Cu 본딩에서의 Ag 나노막 효과

[마이크로전자 및 패키징학회지]

Ar/N2 2단계 플라즈마 처리에 따른 저온 Cu-Cu 직접 접합부의 정량적 계면접착에너지 평가 및 분석

[ELECTRONIC MATERIALS LETTERS]

Characteristics of Copper Nitride Nanolayer Used in 3D Cu Bonding Interconnects

[IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY,]

Low-Temperature (260 ?C) Solderless Cu?Cu Bonding for Fine-Pitch 3-D Packaging and Heterogeneous Integration

[Scientific Reports]

Anti?oxidant copper layer by remote mode N2 plasma for low temperature copper?copper bonding

[IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY]

Comprehensive Analysis of a Cu Nitride Passivated Surface That Enhances Cu-to-Cu Bonding

[마이크로전자 및 패키징학회지]

구리 질화막을 이용한 구리 접합 구조의 접합강도 연구

[IEEE ECTC Proceeding]

Effects of two-step plasma treatment on Cu and SiO2 surfaces for 3D bonding applications

[IEEE ECTC Proceeding]

Development of CMOS-Compatible Low Temperature Cu Bonding Optimized by the Response Surface Methodology

[마이크로전자 및 패키징학회지]

Cu-SiO2 하이브리드 본딩

[IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY]

Two-Step Plasma Treatment on Copper Surface for Low-Temperature Cu Thermo-Compression Bonding

[Microsystem Technologies]

Process and characterization of photo-definable organic?inorganic dielectric for wafer level packaging

[Microsystem Technologies]

Nitrogen passivation formation on Cu surface by Ar?N2 plasma for Cu-to-Cu wafer stacking application

[Applied Sciences]

Two-Step Plasma Treatment on Sputtered and Electroplated Cu Surfaces for Cu-To-Cu Bonding Application

[마이크로 전자 및 패키징 학회지]

실험계획법을 통한 구리 질화물 패시베이션 형성을 위한 아르곤 플라즈마 영향 분석