전체 25건
| 번호 | 논문명 | 발행처명 | ISBN번호 | 게재년월 |
|---|---|---|---|---|
| 25 |
[applied sciences] Low-Temperature Diffusion of Au and Ag Nanolayers for Cu Bonding 발행처명MDPI ISBN번호 게재년월2024-01 |
MDPI | 2024-01 | |
| 24 |
[반도체디스플레이기술학회지] Design of 60-GHz Back-to-back Differential Patch Antenna on Silicon Substrate 발행처명한국반도체디스플레이기술학회 ISBN번호17382270 게재년월2023-12 |
한국반도체디스플레이기술학회 | 17382270 | 2023-12 |
| 23 |
[electronics] Guidelines for Area Ratio between Metal Lines and Vias to Improve the Reliability of Interconnect Systems in High-Density Electronic Devices 발행처명MDPI ISBN번호2079-9292 게재년월2023-10 |
MDPI | 2079-9292 | 2023-10 |
| 22 |
[Microelectronic Engineering] Nano-capsuled thermal interface materials filler using defective multilayered graphene-coated silver nanoparticles 발행처명elsvier ISBN번호0167-9317 게재년월2023-09 |
elsvier | 0167-9317 | 2023-09 |
| 21 |
[IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY,] Thermomechanical Challenges of 2.5-D Packaging: A Review of Warpage and Interconnect Reliability 발행처명IEEE ISBN번호2156-3950 게재년월2023-09 |
IEEE | 2156-3950 | 2023-09 |
| 20 |
[IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY] Effect of the Annealing Process on Cu Bonding Quality Using Ag Nanolayer 발행처명IEEE ISBN번호2156-3950 게재년월2023-05 |
IEEE | 2156-3950 | 2023-05 |
| 19 |
[Journal of Electrical Engineering & Technology] Compact, Flexible and Transparent Antenna Using MMF for Conformal Wi?Fi 7 Applications 발행처명Springer ISBN번호2093-7423 게재년월2023-04 |
Springer | 2093-7423 | 2023-04 |
| 18 |
[Electronic Materials Letters] Copper Bonding Technology in Heterogeneous Integration 발행처명Springer ISBN번호1738-8090 게재년월2023-04 |
Springer | 1738-8090 | 2023-04 |
| 17 |
[APPLIED SCIENCES-BASEL] A Review of Cell Operation Algorithm for 3D NAND Flash Memory 발행처명MDPI ISBN번호2076-3417 게재년월2022-10 |
MDPI | 2076-3417 | 2022-10 |
| 16 |
[JOURNAL OF ELECTRONIC MATERIALS] Low-Temperature Diffusion Behavior of Ti in Cu/Ti-Ti/Cu Bonding 발행처명SPRINGER ISBN번호0361-5235 게재년월2022-03 |
SPRINGER | 0361-5235 | 2022-03 |
| 15 |
[APPLIED SURFACE SCIENCE] Fabrication of multilayer Graphene-coated Copper nanoparticles for application as a thermal interface material 발행처명ELSEVIER ISBN번호0169-4332 게재년월2022-01 |
ELSEVIER | 0169-4332 | 2022-01 |
| 14 |
[APPLIED SCIENCES-BASEL] The Effect of an Ag Nanofilm on Low-Temperature Cu/Ag-Ag/Cu Chip Bonding in Air 발행처명MDPI ISBN번호2076-3417 게재년월2021-10 |
MDPI | 2076-3417 | 2021-10 |
| 13 |
[마이크로전자 및 패키징학회지] 저온 Cu-Cu본딩을 위한 12nm 티타늄 박막 특성 분석 발행처명한국마이크로전자및패키징학회 ISBN번호12269360 게재년월2021-09 |
한국마이크로전자및패키징학회 | 12269360 | 2021-09 |
| 12 |
[마이크로전자 및 패키징학회지] Ar/N2 2단계 플라즈마 처리에 따른 저온 Cu-Cu 직접 접합부의 정량적 계면접착에너지 평가 및 분석 발행처명한국마이크로전자및패키징학회 ISBN번호12269360 게재년월2021-06 |
한국마이크로전자및패키징학회 | 12269360 | 2021-06 |
| 11 |
[마이크로전자 및 패키징학회지] 저온 Cu/Ag-Ag/Cu 본딩에서의 Ag 나노막 효과 발행처명한국마이크로전자및패키징학회 ISBN번호12269360 게재년월2021-06 |
한국마이크로전자및패키징학회 | 12269360 | 2021-06 |
| 10 |
[ELECTRONIC MATERIALS LETTERS] Characteristics of Copper Nitride Nanolayer Used in 3D Cu Bonding Interconnects 발행처명KOREAN INST METALS MATERIALS ISBN번호1738-8090 게재년월2021-05 |
KOREAN INST METALS MATERIALS | 1738-8090 | 2021-05 |
| 9 |
[IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY,] Low-Temperature (260 ?C) Solderless Cu?Cu Bonding for Fine-Pitch 3-D Packaging and Heterogeneous Integration 발행처명IEEE ISBN번호2156-3950 게재년월2021-04 |
IEEE | 2156-3950 | 2021-04 |
| 8 |
[IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY] Comprehensive Analysis of a Cu Nitride Passivated Surface That Enhances Cu-to-Cu Bonding 발행처명IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC ISBN번호2156-3950 게재년월2020-12 |
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | 2156-3950 | 2020-12 |
| 7 |
[Scientific Reports] Anti?oxidant copper layer by remote mode N2 plasma for low temperature copper?copper bonding 발행처명Nature ISBN번호2045-2322 게재년월2020-12 |
Nature | 2045-2322 | 2020-12 |
| 6 |
[마이크로전자 및 패키징학회지] 구리 질화막을 이용한 구리 접합 구조의 접합강도 연구 발행처명한국마이크로전자및패키징학회 ISBN번호12269360 게재년월2020-09 |
한국마이크로전자및패키징학회 | 12269360 | 2020-09 |
| 5 |
[IEEE ECTC Proceeding] Effects of two-step plasma treatment on Cu and SiO2 surfaces for 3D bonding applications 발행처명IEEE ISBN번호2377-5726 게재년월2020-08 |
IEEE | 2377-5726 | 2020-08 |
| 4 |
[IEEE ECTC Proceeding] Development of CMOS-Compatible Low Temperature Cu Bonding Optimized by the Response Surface Methodology 발행처명IEEE ISBN번호2377-5726 게재년월2020-08 |
IEEE | 2377-5726 | 2020-08 |
| 3 |
[마이크로전자 및 패키징학회지] Cu-SiO2 하이브리드 본딩 발행처명한국마이크로전자및패키징학회 ISBN번호12269360 게재년월2020-03 |
한국마이크로전자및패키징학회 | 12269360 | 2020-03 |
| 2 |
[IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY] Two-Step Plasma Treatment on Copper Surface for Low-Temperature Cu Thermo-Compression Bonding 발행처명IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC ISBN번호2156-3950 게재년월2020-02 |
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | 2156-3950 | 2020-02 |
| 1 |
[Microsystem Technologies] Process and characterization of photo-definable organic?inorganic dielectric for wafer level packaging 발행처명Springer ISBN번호0946-7076 게재년월2019-12 |
Springer | 0946-7076 | 2019-12 |
