[2011년도 추계 학술 발표회 논문집]

Discrimination of Vehicle Fluids using Portable FT-IR and XRF

[IUMRS-ICA 2011]

Fabrication and reliability of wafer level Cu-to-Cu bonding for 3D Integration

[IUMRS-ICA 2011]

Comparative study between N2-doped tin oxide by sputtering of

[한국생산제조시스템학회 초록집]

3D 패키지를 위한 웨이퍼 레벨 Cu-Cu 본딩 기술

[대한기계학회 초록집]

마이크로시스템 패키징 기술 개발

[ENGE2011]

Effect of nitrogen doped SnO thin films deposited by reactive sputting

[ENGE2011]

Characterization of Cu CMP for Cu interconnect with Ti barrier

[ENGE2011]

Cu-Cu Thermo-compression Bonding for wafer-to-wafer stacking

[ENGE2011]

The effects of heat treatment on room temperature ferromagnet

[한국마이크로전자 및 패키징학회 2011년 추계학술발표회]

CMP process for Ti/Cu interconnect

[한국마이크로전자 및 패키징학회 2011년 추계학술발표회]

Fabrication and characterization of wafer level Cu bonding

[한국마이크로전자 및 패키징학회 2011년 추계학술발표회]

Wafer level stacking technology for 3D packaging with Cu-Cu bonding